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Breakthroughs

Podcast: The future of electronics goes beyond circuit boards

NSF-supported researcher Ethan Secor describes a specialized additive manufacturing process and the materials used to produce circuits that can be customized to conform to complex three-dimensional surfaces. The discussion emphasizes fabricating electronics directly onto non-flat forms as an alternative to traditional flat circuit boards.

Original reporting: NSF · Research · by NSF · 1 min read

Originally published by NSF · Research: First briefed by The Daily Lift: Last updated:
Illustrative photo: Close-up macro image of a small rectangular electronic component showing a layered green substrate, a rough solder joint with an attached wire, and a 1 mm scale bar for size reference.
Illustrative photo: Phiarc — Uncased film capacitor schoopage.jpg · Wikimedia Commons · CC BY-SA 4.0. Changes: photo cropped and resized by The Daily Lift. This adapted photo is shared under the same licence, CC BY-SA 4.0. The licence applies to the photo only, not to the story text. If the remote photo is unavailable, a labelled original TDL illustration is shown instead.

Why this is good news

Designers and manufacturers integrating electronics into curved or irregular objects could benefit because the process fabricates circuits directly onto non-flat forms. Demonstrating materials and an additive manufacturing approach for customizable circuits matters as it offers an alternative to relying on traditional flat circuit boards.

What happens next

What tests will be used to evaluate the electrical performance, durability, and manufacturing repeatability of circuits produced on varied three-dimensional surfaces?

Read the full story at NSF · Research

This is a short original brief by The Daily Lift, not the publisher's full article. Credit and copyright for the original reporting remain with NSF · Research.

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